SA封装基底选项 | 规格 | 价格 |
无封装 x=5.0-0 | • Single chip, unmounted | € 624 |
x = 1.0b/1.3b -0 |
• Batch of 4 unmounted chips • Chip area 1.3 mm x 1.3 mm 或 1.0 mm x 1.0 mm • Chip thickness 100 µm, for fiber laser butt coupling, |
€ 624 |
x = 5.0-12.7g-c / 5.0-12.7g |
• Chip area 5.0 mm x 5.0 mm • Chip thickness 625 µm, both sides AR coated • Glued on a copper heat sink with 12.7 mm diameter and 4 mm hole • Center mounted (standard): x = 5.0-12.7g-c • Edge mounted : x = 5.0-12.7g-e |
€ 702 |
x = 5.0-25.0g-c / 5.0-25.0g | • Chip area 5.0 mm x 5.0 mm • Chip thickness 625 µm, both sides AR coated • Glued on a copper heat sink with 25.0 mm diameter and 4 mm hole • Center mounted (standard): x = 5.0-25.0g-c • Edge mounted : x = 5.0-25.0g-e |
€ 702 |
x = 5.0-25.4g-c / 5.0-25.4g | • Chip area 5.0 mm x 5.0 mm • Chip thickness 625 µm, both sides AR coated • Glued on a copper heat sink with 25.4 mm diameter and 4 mm hole • Center mounted (standard): x = 5.0-25.4g-c • Edge mounted : x = 5.0-25.4g-e |
€ 702 |
x = FC/PC / FC/APC | • Mounted inside a 1 m long single mode fiber. • Available fibers: HI 980, HI 1060, Panda SM98-PS-U25A • FC/PC connector: x = FC/PC • FC/APC connector: x = FC/APC |
€ 950 |
SA型号 | 规格 |
SA-1020-40-500fs-x | SAM: λ =1020nm, Absorptance 40%, τ ~ 500fs |
SA-1030-34-3ps-x | SAM: λ =1020nm, Absorptance 34%, τ ~ 3ps |
SA-1064-14-28ps-x | SAM: λ =1064nm, Absorptance 14%, τ ~ 28ps |
SA-1064-25-500fs-x | SAM: λ =1064nm, Absorptance 25%, τ ~ 500fs |
SA-1064-26-37ps-x | SAM: λ =1064nm, Absorptance 26%, τ ~ 37ps |
SA-1064-40-500fs-x | SAM: λ =1064nm, Absorptance 40%, τ ~ 500fs |
SA-1340-22-20ps-x | SAM: λ =1340nm, Absorptance 22%, τ ~ 20fs |
SA-1550-6-20ps-x | SAM: λ =1550nm, Absorptance 6%, τ ~ 20fs |
SA-1550-35-2ps-x | SAM: λ =1550nm, Absorptance 35%, τ ~ 2ps |
SA-1550-46-2ps-x | SAM: λ =1550nm, Absorptance 46%, τ ~ 2ps |
SA-2000-1-10ps-x | SAM: λ =2000nm, Absorptance 1%, τ ~ 10ps |
SA-2000-25-10ps-x | SAM: λ =2000nm, Absorptance 25%, τ ~ 10ps |
SA-2000-43-10ps-x | SAM: λ =2000nm, Absorptance 43%, τ ~ 10ps |
SA-2800-10-10ps-x | SAM: λ =2800nm, Absorptance 10%, τ ~ 10ps |
RSA封装基底选项 | 规格 | 价格 |
无封装 x=5.0-0 | • Single chip, unmounted | € 624 |
x = 1.0b/1.3b -0 |
• Batch of 4 unmounted chips • Chip area 1.3 mm x 1.3 mm 或 1.0 mm x 1.0 mm • Chip thickness 100 µm, for fiber laser butt coupling, |
€ 624 |
x = 5.0-12.7g |
• Chip area 5.0 mm x 5.0 mm • Chip thickness 625 µm, both sides AR coated • Glued on a copper heat sink with 12.7 mm diameter and 4 mm hole • Center mounted (standard): x = 5.0-12.7g-c • Edge mounted : x = 5.0-12.7g-e |
€ 702 |
x = 5.0-25.0g | • Chip area 5.0 mm x 5.0 mm • Chip thickness 625 µm, both sides AR coated • Glued on a copper heat sink with 25.0 mm diameter and 4 mm hole • Center mounted (standard): x = 5.0-25.0g-c • Edge mounted : x = 5.0-25.0g-e |
€ 702 |
x = 5.0-25.4g | • Chip area 5.0 mm x 5.0 mm • Chip thickness 625 µm, both sides AR coated • Glued on a copper heat sink with 25.4 mm diameter and 4 mm hole • Center mounted (standard): x = 5.0-25.4g-c • Edge mounted : x = 5.0-25.4g-e |
€ 702 |
品牌: | BATOP |
型号: | 可饱和吸收体SA |
加工定制: | 否 |
测量范围: | 980-3000nm |
测量精度: | 0.01 ° |
外形尺寸: | 多种封装方式 mm |
用途: | 用于产生超快激光 |
长度: | 0.2 mm |